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Nanocrystalline diamond-glass platform for the development of three-dimensional micro- and nanodevices
https://oist.repo.nii.ac.jp/records/1361
https://oist.repo.nii.ac.jp/records/1361c79b2d60-c016-480e-a5f4-b52750128dcd
名前 / ファイル | ライセンス | アクション |
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Janssens-2019-Nanocrystalline diamond-glass pl (2.3 MB)
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Creative Commons Attribution 4.0 International(https://creativecommons.org/licenses/by/4.0/)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2020-04-15 | |||||
タイトル | ||||||
言語 | en | |||||
タイトル | Nanocrystalline diamond-glass platform for the development of three-dimensional micro- and nanodevices | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者(英) |
Janssens, Stoffel D.
× Janssens, Stoffel D.× Vázquez-Cortés, David× Giussani, Alessandro× Kwiecinski, James A.× Fried, Eliot |
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書誌情報 |
en : Diamond and Related Materials 巻 98, p. 107511, 発行日 2019-08-10 |
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抄録 | ||||||
内容記述タイプ | Other | |||||
内容記述 | Low-cost and robust platforms are key for the development of next-generation 3D micro- and nanodevices. To fabricate such platforms, nanocrystalline diamond (NCD) is a highly appealing material due to its biocompatibility, robustness, and mechanical, electrical, electrochemical, and optical properties, while glass substrates with through vias are ideal interposers for 3D integration due to the excellent properties of glass. However, developing devices that comprise NCD films and through glass vias (TGVs) has rarely been attempted due to a lack of effective process strategies. In this work, a low-cost process - free of photolithography and transfer-printing - for fabricating arrays of TGVs that are sealed with suspended portions of an ultra-thin NCD film on one side is presented. These highly transparent structures may serve as a platform for the development of microwells for single-cell culture and analysis, 3D integrated devices such as microelectrodes, and quantum technologies. The process is demonstrated by fabricating TGVs that are sealed with an NCD film of thickness 175 nm and diameter 60 mu m. The technology described can be extended by replacing NCD with silicon nitride or silicon carbide, allowing for the development of complex heterogeneous structures on the small scale. | |||||
出版者 | ||||||
出版者 | Elsevier B.V. | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 0925-9635 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | info:doi/10.1016/j.diamond.2019.107511 | |||||
権利 | ||||||
権利情報 | © 2019 The Author(s) | |||||
情報源 | ||||||
関連名称 | https://creativecommons.org/licenses/by/4.0/ | |||||
関連サイト | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://www.sciencedirect.com/science/article/pii/S0925963519304650 | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 |